PI (Polyimide) Powder, Rod, Sheet, CNC Design Products
Thermosetting polyamides e tsebahala ka botsitso ba mocheso, khanyetso e ntle ea lik'hemik'hale, thepa e ntle ea mochini, le sebopeho sa 'mala oa lamunu / mosehla. Polyamides e kopantsoeng le graphite kapa khalase ea fiber reinforcements e na le matla a ho fetoha a fihlang ho 340 MPa (49,000 psi) le flexural moduli ea 21,000 MPa (3,000,000 psi). Thermoses polymer matrix polyamides e bonts'a ho thella ho tlase haholo le matla a phahameng a tsitsipano. Thepa ena e bolokoa nakong ea tšebeliso e tsoelang pele ho mocheso oa ho fihla ho 232 °C (450 °F) le bakeng sa maeto a makhutšoane, a holimo ho 704 °C (1,299 °F).[11] Likarolo tse entsoeng ka polyimide le laminate li na le ho hanyetsa mocheso o motle haholo. Lithempereichara tse tloaelehileng tsa ho sebetsa bakeng sa likarolo tse joalo le li-laminate li tloha ho cryogenic ho ea ho tse fetang 260 °C (500 °F). Li-Polyamides ka tlhaho ha li khone ho tuka 'me hangata ha li hloke ho tsoakoa le li-flame retardants. Ba bangata ba na le lintlha tsa UL tsa VTM-0. Li-laminate tsa polyimide li na le matla a ho feto-fetoha ha halofo ea bophelo ho 249 °C (480 °F) ea lihora tse 400.
Likarolo tse tloaelehileng tsa polyimide ha li amehe ke lihlapolli le oli tse sebelisoang hangata - ho kenyeletsoa li-hydrocarbon, ester, ethers, alcohols le ferns. Li boetse li hanela li-acid tse fokolang empa ha li khothalletsoe ho sebelisoa libakeng tse nang le alkalis kapa inorganic acid. Li-polyamides tse ling, tse kang CP1 le CORIN XLS, li qhibiliha 'me li bontša ho hlaka ho hoholo ha mahlo. Thepa ea solubility e ba alima bakeng sa ts'ebeliso ea sefafatsi le mocheso o tlase.
Likarolo tsa PI
PI ke polymer ea eona e thibelang mollo, e sa cheseng mocheso o phahameng
Mechanical thepa kutlo tlaase mocheso
Boitsebiso bo na le bokhoni bo botle ba 'mala, bo ka finyella litlhoko tse sa tšoaneng tsa ho kopanya mebala
Ts'ebetso e ntle ea mocheso: Mocheso o phahameng le ho hanyetsa mocheso o tlase
Ts'ebetso e ikhethang ea motlakase: Insulation ea motlakase e phahameng
PI Main Application Field
E sebelisoa haholo mechini, lisebelisoa, likarolo tsa likoloi, motlakase le elektroniki, terene, lisebelisoa tsa lapeng, likhokahano, metjhini ea masela, lipapali le lihlahisoa tsa boikhathollo, lipeipi tsa oli, litanka tsa mafura le lihlahisoa tse ling tsa boenjiniere tse nepahetseng.
Lisebelisoa tsa polyimide li bobebe, lia tenyetseha, li hanyetsa mocheso le lik'hemik'hale. Ka hona, li sebelisoa indastering ea lisebelisoa tsa elektroniki bakeng sa likhoele tse tenyetsehang le joalo ka filimi e sireletsang holim'a terata ea makenete. Ka mohlala, k'homphieutheng ea laptop, mohala o kopanyang boto e kholo ea logic ho pontšo (e tlamehang ho fetoha nako le nako ha laptop e buloa kapa e koaloa) hangata ke setsi sa polyimide se nang le li-conductor tsa koporo. Mehlala ea lifilimi tsa polyimide e kenyelletsa Apical, Kapton, UPILEX, VTEC PI, Norton TH le Kaptrex.
Tšebeliso e 'ngoe ea polyimide resin ke lesela le sireletsang le ho feta ha ho etsoa li-circuits tse kopantsoeng le li-chips tsa MEMS. Likarolo tsa polyimide li na le bolelele bo botle ba mochini le matla a ho tsitsa, a thusang hape ho khomarela lipakeng tsa masela a polyimide kapa lipakeng tsa lera la polyimide le lera la tšepe le behiloeng.
| Tšimo | Linyeoe tsa Kopo |
| Karolo ea indasteri | Mocheso o phahameng oa ho itlotsa ka letsoho, reng ea piston ea compressor, selikalikoe sa tiiso |
| Lisebelisoa tsa motlakase | Li-radiator, fene e pholisang, mohele oa lemati, sekoaelo sa tanka ea mafura, grille ea ho kenya moea, sekoaelo sa tanka ea metsi, sets'oants'o sa lebone |
SPLA-3D Kereiti Le Tlhaloso
| Kereiti | Tlhaloso |
| SPLA-3D101 | PLA ea ts'ebetso e phahameng. PLA e ikarabella ho feta 90%. Phello e ntle ea khatiso le matla a holimo. Melemo ke ho theha ka mokhoa o tsitsitseng, khatiso e boreleli le thepa e babatsehang ea mechine. |
| SPLA-3DC102 | PLA e nka 50-70% mme e tletse haholo ebile e thatafalitsoe. Melemo ea ho theha e tsitsitseng, khatiso e boreleli le thepa e ntle ea mochini. |
